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Everything you purchase today that is electronic uses circuit boards to keep them running. How these circuit boards are made demands use of complicated specialty equipment designed specifically for making the components for tablets, smart phones and virtually every other electronic devise available. One of the machines needed to create these mobile connections and ensure they work is the reflow soldering oven.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The beginning zone is called a preheat period. As the name implies it serves to find the proper temperature needed to complete the task. The ramp up rate is important because if the temperature is too hot or too cold it will create problems with the finished product. When the heat rises too fast or too high it can cause solder to crack or spatter and too low or slow can create problems with the melting process of solder leaving it dull or brittle.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The reflow zone is also called the time above liquidus or TAL. This is the point where the highest temperature is reached. This is a very important component because it must not surpass the highest temperature that can be tolerated by the part most sensitive to thermal damage. The process takes approximately one minute and should be closely monitored to ensure the temperatures do not surpass the limit set for the piece.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
Most equipment used in this process allows the operator to see what is happening inside the closed unit. Some are equipped with viewing windows and others can be attached to a screen using a USB connection. This viewing allows the operator to adjust the temperatures while monitoring the progress of each board.
These ovens come in many different sizes. They may range from small units that can be placed on the surface of a bench to units that are longer than six feet. The importance of them is demonstrated everyday in products used to communicate with others as well as for mobile intelligence and gaming. They help to make the world smaller with each new devise they help to create.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The beginning zone is called a preheat period. As the name implies it serves to find the proper temperature needed to complete the task. The ramp up rate is important because if the temperature is too hot or too cold it will create problems with the finished product. When the heat rises too fast or too high it can cause solder to crack or spatter and too low or slow can create problems with the melting process of solder leaving it dull or brittle.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The reflow zone is also called the time above liquidus or TAL. This is the point where the highest temperature is reached. This is a very important component because it must not surpass the highest temperature that can be tolerated by the part most sensitive to thermal damage. The process takes approximately one minute and should be closely monitored to ensure the temperatures do not surpass the limit set for the piece.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
Most equipment used in this process allows the operator to see what is happening inside the closed unit. Some are equipped with viewing windows and others can be attached to a screen using a USB connection. This viewing allows the operator to adjust the temperatures while monitoring the progress of each board.
These ovens come in many different sizes. They may range from small units that can be placed on the surface of a bench to units that are longer than six feet. The importance of them is demonstrated everyday in products used to communicate with others as well as for mobile intelligence and gaming. They help to make the world smaller with each new devise they help to create.
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